Open Access Book
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Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces

Author: Lindenmann, Nicole
Source: Directory of Open Access Books
Publisher: KIT Scientific Publishing
ISBN: 9783731507468
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To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.